| Water Size | 6"/8"/12" |
| Inspection Accuracy | 1.4um, 4.3um, 0.8um, 0.4um |
| Inspection Items | Bare wafer and framed wafer |
| Inspection Process | Wafer-level packaging Bump, Process inspection of scribe line, etc. |
| Main Defect Types | Scratch, RDL Short/Break, Bump Metrology/Inspection, Scribe Line Chipping, Peeling, etc. |
